{
  "programme": {
    "id": "prg-us-chips-incentives",
    "name": "CHIPS Incentives Program",
    "nameOriginal": null,
    "actor": "us",
    "kind": "multi_instrument",
    "administeringOrgIds": [
      "org-us-commerce"
    ],
    "parentProgrammeId": null,
    "legalAuthorityAsStated": "CHIPS Act of 2022 (CHIPS and Science Act)",
    "evidence": [
      {
        "sourceId": "src-usar-8k-2026-06-03",
        "supports": [
          "name",
          "kind",
          "administrators",
          "legal_authority"
        ],
        "evidence": "explicit",
        "locator": "Item 1.01, first paragraph",
        "note": "\"under the CHIPS Incentives Program—Facilities for Semiconductor Materials and Manufacturing Equipment under the CHIPS Act of 2022\": direct funding awards and a loan guarantee from the DOC."
      }
    ],
    "notes": "Run by the Department of Commerce's CHIPS Program Office. It provides direct funding and loans or loan guarantees, recorded as their own instruments."
  },
  "parentProgrammeId": null,
  "childProgrammeIds": [],
  "envelopesListedNotSummed": [],
  "recordedAwardTotals": {
    "currencies": [
      {
        "currency": "USD",
        "countedIds": [
          "fin-us-chips-usar-2026-direct-funding",
          "fin-us-chips-usar-2026-loan-guarantee"
        ],
        "nestedIds": [
          "fin-us-chips-usar-2026-magnet-project-2-direct-funding",
          "fin-us-chips-usar-2026-magnet-project-2-loan-guarantee",
          "fin-us-chips-usar-2026-metal-project-2-direct-funding",
          "fin-us-chips-usar-2026-metal-project-2-loan-guarantee",
          "fin-us-chips-usar-2026-round-top-direct-funding",
          "fin-us-chips-usar-2026-round-top-loan-guarantee",
          "fin-us-chips-usar-2026-stillwater-magnet-direct-funding",
          "fin-us-chips-usar-2026-stillwater-magnet-loan-guarantee",
          "fin-us-chips-usar-2026-stillwater-metal-direct-funding",
          "fin-us-chips-usar-2026-stillwater-metal-loan-guarantee"
        ],
        "status": "summed",
        "instruments": [
          {
            "instrument": "loan_guarantee",
            "countedIds": [
              "fin-us-chips-usar-2026-loan-guarantee"
            ],
            "summed": true,
            "byQualifier": {
              "up_to": "1300000000"
            },
            "binding": {
              "up_to": "1300000000"
            },
            "notYetBinding": {}
          },
          {
            "instrument": "unspecified",
            "countedIds": [
              "fin-us-chips-usar-2026-direct-funding"
            ],
            "summed": false,
            "reason": "instrument_not_stated",
            "byQualifier": null,
            "binding": null,
            "notYetBinding": null
          }
        ],
        "overlap": null
      }
    ],
    "unquantifiedIds": [],
    "endedIds": [],
    "statusNotStatedIds": []
  },
  "recordedAwardIds": [
    "fin-us-chips-usar-2026-direct-funding",
    "fin-us-chips-usar-2026-loan-guarantee",
    "fin-us-chips-usar-2026-magnet-project-2-direct-funding",
    "fin-us-chips-usar-2026-magnet-project-2-loan-guarantee",
    "fin-us-chips-usar-2026-metal-project-2-direct-funding",
    "fin-us-chips-usar-2026-metal-project-2-loan-guarantee",
    "fin-us-chips-usar-2026-round-top-direct-funding",
    "fin-us-chips-usar-2026-round-top-loan-guarantee",
    "fin-us-chips-usar-2026-stillwater-magnet-direct-funding",
    "fin-us-chips-usar-2026-stillwater-magnet-loan-guarantee",
    "fin-us-chips-usar-2026-stillwater-metal-direct-funding",
    "fin-us-chips-usar-2026-stillwater-metal-loan-guarantee"
  ],
  "otherLayers": [
    {
      "layer": "indication",
      "rowIds": [
        "fin-us-commerce-chips-vulcan-2025-incentives"
      ],
      "totals": null
    }
  ],
  "designationIds": [],
  "sources": [
    {
      "id": "src-usar-8k-2026-06-03",
      "title": "USA Rare Earth, Inc. Form 8-K (June 3, 2026): Direct Funding Agreement and Loan Guarantee Agreement with the Department of Commerce",
      "publisher": "USA Rare Earth, Inc. / U.S. Securities and Exchange Commission (EDGAR)",
      "url": "https://www.sec.gov/Archives/edgar/data/1970622/000121390026064453/ea0293402-8k_usarare.htm",
      "language": "en",
      "datePublished": "2026-06-03",
      "dateAccessed": "2026-09-23",
      "sourceType": "official",
      "confidence": "primary",
      "notes": "The recipient's binding filing, read in a browser on 2026-09-23. Item 1.01 describes the Direct Funding Agreement (up to $277.0 million in five project awards) and the Loan Guarantee Agreement (the DOC guarantees $1.3 billion of Federal Financing Bank advances in five project tranches), both entered into on 3 June 2026 under the \"CHIPS Incentives Program—Facilities for Semiconductor Materials and Manufacturing Equipment\"; milestone-based disbursement; equity-raise requirements; covenants; and the Securities Issuance Agreement (16,132,790 shares and a warrant for 17,600,584 shares at $17.17 to the DOC). Cover page: incorporated in Delaware. It supports contract and financing facts it states directly and is attributed to the company."
    }
  ]
}