{
  "organization": {
    "id": "org-usa-rare-earth",
    "name": "USA Rare Earth, Inc.",
    "nameOriginal": null,
    "aliases": [
      "USAR"
    ],
    "kind": "company",
    "countryCode": "US",
    "actor": null,
    "parents": [],
    "evidence": [
      {
        "sourceId": "src-usar-8k-2026-06-03",
        "supports": [
          "name",
          "kind",
          "country"
        ],
        "evidence": "explicit",
        "locator": "Cover page",
        "note": "State of incorporation: Delaware; principal executive offices in Stillwater, Oklahoma."
      }
    ],
    "notes": null
  },
  "rolledUpOrganizationIds": [
    "org-usa-rare-earth"
  ],
  "providedRowIds": [],
  "receivedRowIds": [
    "fin-us-chips-usar-2026-direct-funding",
    "fin-us-chips-usar-2026-loan-guarantee",
    "fin-us-chips-usar-2026-magnet-project-2-direct-funding",
    "fin-us-chips-usar-2026-magnet-project-2-loan-guarantee",
    "fin-us-chips-usar-2026-metal-project-2-direct-funding",
    "fin-us-chips-usar-2026-metal-project-2-loan-guarantee",
    "fin-us-chips-usar-2026-round-top-direct-funding",
    "fin-us-chips-usar-2026-round-top-loan-guarantee",
    "fin-us-chips-usar-2026-stillwater-magnet-direct-funding",
    "fin-us-chips-usar-2026-stillwater-magnet-loan-guarantee",
    "fin-us-chips-usar-2026-stillwater-metal-direct-funding",
    "fin-us-chips-usar-2026-stillwater-metal-loan-guarantee"
  ],
  "sponsoredProjectIds": [
    "prj-us-usar-magnet-project-2",
    "prj-us-usar-metal-project-2",
    "prj-us-usar-round-top",
    "prj-us-usar-stillwater-magnet",
    "prj-us-usar-stillwater-metal"
  ],
  "administeredProgrammeIds": [],
  "heldDesignationIds": [],
  "children": [],
  "sources": [
    {
      "id": "src-usar-8k-2026-06-03",
      "title": "USA Rare Earth, Inc. Form 8-K (June 3, 2026): Direct Funding Agreement and Loan Guarantee Agreement with the Department of Commerce",
      "publisher": "USA Rare Earth, Inc. / U.S. Securities and Exchange Commission (EDGAR)",
      "url": "https://www.sec.gov/Archives/edgar/data/1970622/000121390026064453/ea0293402-8k_usarare.htm",
      "language": "en",
      "datePublished": "2026-06-03",
      "dateAccessed": "2026-09-23",
      "sourceType": "official",
      "confidence": "primary",
      "notes": "The recipient's binding filing, read in a browser on 2026-09-23. Item 1.01 describes the Direct Funding Agreement (up to $277.0 million in five project awards) and the Loan Guarantee Agreement (the DOC guarantees $1.3 billion of Federal Financing Bank advances in five project tranches), both entered into on 3 June 2026 under the \"CHIPS Incentives Program—Facilities for Semiconductor Materials and Manufacturing Equipment\"; milestone-based disbursement; equity-raise requirements; covenants; and the Securities Issuance Agreement (16,132,790 shares and a warrant for 17,600,584 shares at $17.17 to the DOC). Cover page: incorporated in Delaware. It supports contract and financing facts it states directly and is attributed to the company."
    }
  ]
}